Glossary of Technical Terms/Explanation of Terms HOME Solution Glossary of Technical Terms/Explanation of Terms ABCDEFGHIJKLMNOPQRSTUVWXYZother A AGV B Blank (mask)Bump bondingBall bonding C crystal devicesC4C2Cavity vacuum moldingCompression MoldCDIMCUFCenter dot D Die bonding E EFEMEutectic Die Bonding F FOWLPFOUPFlip Chip BondingFAMEFull moldFlux G GEM J Jet dispensing L Load PortLPMLidLooping M Mold chaseMUFMEMS( crystal oscillator/oscillator)MTBFMTBAMolding N NCFNCPNRS O OHTOscillator P Puzzle splicerPaste Die BondingPulse HeaterPlunge Up R RPSRGV S Stitch bondingSpiral dispenseSplicingSolder Die Bonding T Trim and forming system (cut and bending system)TCXOTrim and forming tool (cut and bending tool)TCBTTVTCMTransfer Mold U UPH W WLPWire bonding PRODUCT INFORMATION CORPORATE INFORMATION Contact Us For products and various inquiries, click here. List of inquiries