Glossary of Technical Terms/Explanation of Terms

A type of interconnecting method for wire bonding. The tip of the bonding wire is melted by electrical discharge and solidified into a ball to form an initial ball (also called Free Air Ball (FAB)), which is then interconnected with the electrode. A type of solid phase bonding in which solid metals are interconnected to one another. As bonding energy, heat is supplied by the heater and ultrasonic vibration and force are transmitted via the capillary tool. The ball bonding is used for the 1st bond of wire bonding and bump bonding. It is also called nail head bonding.