News Release
- Announcement of sponsorship of ICEP-IAAA2025
- Announcement of Personnel Change in the Board of Directors
- Introduction of the PFA-made Dispenser 'PFD-10'
- Introduction of the PFA-made Micro Particle Picker CAP-series
- Relocation of software R&D subsidiary in Vietnam
- Notice regarding merger between Yamaha Robotics Holdings Co., Ltd. and its subsidiaries
- Notice of Discontinuation of Flip-Chip Bonder YSB55w
- Announcement of Personnel Change in the Board of Directors
- Shinkawa to Release Next-generation High-Speed Wire Bonder: UTC-RZ1
- Multi-process auto-molding equipment Launched the "MS-R Series"