News Release
- Notice of Exhibit at ECTC 2025
- Notice of Exhibit at SEMICON SEA 2025
- Notice regarding merger between Yamaha Robotics Holdings Co., Ltd. and its subsidiaries
- Notice of Discontinuation of Flip-Chip Bonder YSB55w
- Shinkawa to Release Next-generation High-Speed Wire Bonder: UTC-RZ1
- SEMICON JAPAN / APCS 2024 Exhibition
- Shinkawa ／Notice of Discontinuation of Die Bonder SPA-1000
- Establishment of SATAS
- Notice of Exhibit at SEMICON CHINA 2024
- DISCONTINUATION OF AFTER-SALES SERVICE FOR DISCONTINUED MODELS