Glossary of Technical Terms/Explanation of Terms

Liquid that improves solder wettability and pad bondability in flip chip bonding, which is mainly used in the Controlled Collapse Chip Connection (C4), Chip Connection (C2), and Capillary Underfill (CUF) processes. It is applied to the soldering surface of a chip before mounted by the transfer method. Depending on the type of chip to be mounted, the viscosity of the flux material and the amount of transfer are to be adjusted.