Glossary of Technical Terms/Explanation of Terms
Flip Chip Bonding
One type of back-end process of semiconductor fabrication. The process of picking up a fed diced chip with the collet and flipping the chip 180 degrees for the bonding. Generally, a large number of electrodes such as solders, bumps, and pillars are disposed on the bonding surface of the chip, and they are bonded while applying heat to them. There are various types of manufacturing methods such as TCB, C2, C4, and FOWLP. Individual chips are supplied from dicing wafers or tape reels; and the bonding materials include resin substrates, silicon wafers, and glass substrates.