Glossary of Technical Terms/Explanation of Terms

Bonding process by supplying resin adhesive paste mainly composed of epoxy and polyimide, mounting the die at room temperature, and then heating and curing the resin in an oven or the like. Depending on its application, fillers such as conductive silver or insulating alumina are dispersed. Pros are that the work can be easily done in a room temperature, thermal stress can be absorbed, and the cost is inexpensive. Cons are that heat resistance is poor and that bleeding and outgassing are likely to adhere to products and equipment. It is widely used for various types of packages.