Glossary of Technical Terms/Explanation of Terms
WLP（読み方：Wafer Level Package）
Abbreviation for Wafer Level Package.
It used to mean the smallest semiconductor package (FOWLP) in which the semiconductor chip becomes the package size as it is, but it is now called WLP to include wafer-level packages (FOWLP) in which the chip is first cut out and aligned after inspection, the carrier is resin molded into a wafer shape, and the terminals are extended to the outside of the chip using a rewiring layer.