Glossary of Technical Terms/Explanation of Terms

FOUP(読み方:Front-Opening Unified Pod)

Abbreviation for Front-Opening Unified Pod.
An enclosed container for transporting and storing wafers or glass carriers to another process in a semiconductor factory.
It has an opening/closing mechanism on the front of the container and interfaces with semiconductor manufacturing system.
The mini-environment method is used, and the container is sealed to maintain cleanliness around the wafer.

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