Glossary of Technical Terms/Explanation of Terms
CUF（読み方：Capillary Underfill）
Abbreviation for Capillary Underfill. A type of electrode encapsulating method for flip chip bonding. Taking advantage of capillary action, resin is poured into the clearance between an IC chip and a board which are interconnected via metal bumps. The C4, C2, and TCB methods are used for implementation.