Glossary of Technical Terms/Explanation of Terms
Bump bonding
One type of back-end process of semiconductor fabrication. A process of forming protruding electrodes (stud bumps) on the electrodes of chips in the wafer before being diced by performing only ball bonding using bonding wires and capillary tools and then by cutting the bonding wires. After bump bonding, chips are flip-chip connected to form wiring.