Glossary of Technical Terms/Explanation of Terms

A process in which eutectic materials, mainly gold and silicon, are supplied by coating or sheeting on the backside of the chip, then heated and bonded in an anti-oxidant atmosphere. This process has advantages such as high bonding speed, low electrical resistance, and high thermal conductivity, but has disadvantages such as requiring the high temperature process of about 400℃, poor stress relaxation, and high cost. It is used for small area chips, ceramic packages that require high reliability, and devices applied for space (e.g., rockets and satellites).