Glossary of Technical Terms/Explanation of Terms
Wire bonding
One type of back-end process of semiconductor fabrication. The process of forming wiring by making interconnections between two or more electrodes on a chip, lead frame, or resin substrate using bonding wires and capillary tools. Ball bonding and stitch bonding are used for interconnections. Looping forms three-dimensional shape-controlled wiring between each of the bonded ends.