Glossary of Technical Terms/Explanation of Terms
Pulse Heater
A heater that can repeatedly increase and decrease the temperature at high speed, used in the thermal compression bonding (TCB) process of flip chip bonding. The entire chips can be temperature-controlled from room temperature up to 400℃ in a few seconds. When using non-conductive paste (NCP) or non-conductive film (NCF), a heater that can withstand high loads is required.