Glossary of Technical Terms/Explanation of Terms
Plunge Up
A push-up function used in die bonding and flip chip bonding. A chip that has been diced in the dicing process is pushed up by the plunge-up pin and peeled off from the wafer sheet. Simultaneously, the collet picks up the chip by suction. Depending on the size and thickness of a chip, various methods other than the plunge-up pin are available.