Glossary of Technical Terms/Explanation of Terms

Abbreviation for Thermal Compression Bonding. A type of flip chip bonding method. The flip chip bonder is used to mount diced chips onto a substrate and simultaneously heat them to bond their electrodes. In order to respond to narrow-pitch electrodes and high-speed mounting, achieving XY accuracy by a few um and using the high-speed pulse heater are essential. There are several types of electrode encapsulation materials such as NCF, NCP, CUF, and MUF, each of which requires a different mounting process.