Glossary of Technical Terms/Explanation of Terms
Solder Die Bonding
A process in which tin, lead, and their alloys are supplied in ribbons, wires, or pastes, and then heated and bonded in an anti-oxidant atmosphere. The process has strengths in high bonding speed, low electrical resistance, and high thermal conductivity, while the weaknesses are the requirement of high temperature processes of around 300℃, poor stress relaxation, and the restricted use of lead for environmental reasons. It is used for small area chips and power devices.