Molding System
MS-R series

【 Transfer Molding 】
Multi-process auto-molding system

Molds

selling agency

APIC YAMADA CORPORATION

Overview

  • The GTM series, which has a proven track record in transfer molding equipment, has been completely redesigned to improve productivity and molding quality.
  • Pursuing versatility and expandability, maintaining and expanding process capability to support a wide variety of semiconductor packages.

Features

Multi-process for packaging
  • Support a wide variety of packages ranging from general-purpose package to advanced package on a common platform with a varied solution. 
High productivity
  • Reduce the losses of press standby time and optimize cycle time.
  • Increase the number of packages by large format and high density due to newly developed high-rigid press and high-precision, high-pressure clamping chase unit.
High-precision molding
  • Improve filling performance by optimizing mold design and recipe based on resin flow simulation.
  • Achieve excellent molding quality due to high-precision clamping technology.

Product Specifications

ITEMDETAILS
UtilityPower supply3-phase AC200V 50/60Hz
Compression air0.5MPa, 350L/min. or more
Machine size

1 press / (W)2,570×(D)1,795×(H)1,993mm
2 press / (W)3,250×(D)1,795×(H)1,993mm
3 press / (W)3,930×(D)1,795×(H)1,993mm
4 press / (W)4,610×(D)1,795×(H)1,993mm
Machine weight
(including the molds)		1-press / Approx. 5,900kg2-press / Approx. 9,500kg
3-press / Approx. 13,100kg4-press / Approx. 16,700kg

※　Specifications may be changed for improvements without any notice.

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