
Molding System
GTM-X MS
【 Transfer Molding 】
Compact manual molding system
/Heat press
Molds selling agency

Overview
- Manual system using the same molding machine as the automatic machine
- Resin encapsulation of semiconductor packages, general electronic parts, in-vehicle electronic parts, etc. using thermosetting resin is possible.
- Prototype-small quantity, high-mix production is possible.
Features
- 100 x 300mm x 2 frames can be molded
- 60% larger molding area than conventional machines
- Products with a large resin capacity can also be molded
- Large electronic components for in-vehicle applications such as IGBTs and ECUs
- Module product can be molded
- AC servo motor is used for mold clamping and transfer drive.
- Excellent eject operability in the low speed range
- Highly accurate and stable mold clamping and resin injection are possible
- No need for hydraulic oil treatment or cooling water
- It is possible to convert the molding method from transfer to compression etc. just by changing the mold chase.
- A touch panel is used to switch / register products and change molding data.
- Easy to use and operate
- Recording of molding data & external output function is possible
Option support
- FAME mechanism
- Lower substrate suction unit
- Vacuum unit
- Chase monitor
- CDIM molding
- TCM molding
- Data collection function
- Mold transfer jigs and lifters
- Heat press for Sinter
Product Specifications
ITEM | DETAILS |
---|
Press type | 120 ton | 170 ton | |||
Applicable work size | 2 frames / shot / press | ||||
Applicable strip size | Width (mm) | 35~100 | |||
Depth (mm) | 150~300 | ||||
Transfer force | 4.9~29.4kN | 4.9~41.2kN | |||
Machine sizes | Standard | W/options | Standard | W/options | |
Width (mm) | 1,105 | 1,165 | |||
Depth (mm) | 1,745 | 1,847 | 1,745 | 1,847 | |
Height (mm) | 1,980 | 2,285 | 1,993 | 2,298 | |
Machine wieght (kg) (including the molds) | 3,300 | 3,500 | 4,000 | 4,200 | |
Utilities | Air | 0.5MPa 200L/min | |||
Electricity | 3-phase AC200V 50/60Hz |
*Specifications may be changed for improvements without any notice.
*Machibe size and weight wil be changed with FAME, Vacuum Molding, Substrate vacuum options.