Molding System
GTM-X MS

【 Transfer Molding 】
Compact manual molding system
/Heat press

Molds

selling agency

APIC YAMADA CORPORATION

Overview

  • Manual system using the same molding machine as the automatic machine
  • Resin encapsulation of semiconductor packages, general electronic parts, in-vehicle electronic parts, etc. using thermosetting resin is possible.
  • Prototype-small quantity, high-mix production is possible.

Features

  • 100 x 300mm x 2 frames can be molded
  • 60% larger molding area than conventional machines
  • Products with a large resin capacity can also be molded
  • Large electronic components for in-vehicle applications such as IGBTs and ECUs
  • Module product can be molded
  • AC servo motor is used for mold clamping and transfer drive.
  • Excellent eject operability in the low speed range
  • Highly accurate and stable mold clamping and resin injection are possible
  • No need for hydraulic oil treatment or cooling water
  • It is possible to convert the molding method from transfer to compression etc. just by changing the mold chase.
  • A touch panel is used to switch / register products and change molding data.
  • Easy to use and operate
  • Recording of molding data & external output function is possible

Option support

  • FAME mechanism 
  • Lower substrate suction unit
  • Vacuum unit
  • Chase monitor
  • CDIM molding
  • TCM molding
  • Data collection function
  • Mold transfer jigs and lifters
  • Heat press for Sinter

Product Specifications

ITEMDETAILS
Press type120 ton170 ton
Applicable work size2 frames / shot / press
Applicable
strip size
Width (mm)35~100
Depth (mm)150~300
Transfer force4.9~29.4kN4.9~41.2kN
Machine sizes StandardW/optionsStandardW/options
Width (mm)1,1051,165
Depth (mm)1,7451,8471,7451,847
Height (mm)1,9802,2851,9932,298
Machine wieght (kg) (including the molds)3,3003,5004,0004,200
UtilitiesAir0.5MPa 200L/min
Electricity3-phase AC200V 50/60Hz

*Specifications may be changed for improvements without any notice.
*Machibe size and weight wil be changed with FAME, Vacuum Molding, Substrate vacuum options.

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