In the semiconductor assembly process, "resin molding" refers to the process of placing a semiconductor chip on a substrate (lead frame, polyimide tape, etc.), connecting the semiconductor chip to the substrate terminals with metal wires, and hardening the surrounding area with epoxy or other resin to protect the product from external stresses such as shock, temperature, and humidity. In the semiconductor industry In the semiconductor industry, this hardening is called "resin molding," "resin encapsulation," or "mold molding.
There are various types of resins required for resin molding depending on the molding process (method). In addition, different types of resins are used depending on the molding method. Transfer molding, which is a typical molding method, uses resin in tablet form, but liquid resin can also be used.
