| Model | TCM-1000 |
|---|
| Target workpiece (substrate) | Various boards MIN□2mm to MAX□10mm (Other sizes are also available) |
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| Target workpiece (element) | Various elements MIN□1mm to MAX□8mm (Other sizes are also available) |
|---|
| Glue | Conductive adhesives (silicon-based, epoxy-based, etc.) |
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| Coating diameter | φ0.1 to φ0.6 (varies depending on the adhesive used) |
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| Mounting Accuracy | Within ±30 μm |
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| Image Position Compensation | Board position, element position |
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| Imaging function | Coating diameter, element not mounted, element displacement, etc. |
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| Supplying and discharging of parts | Tray (10-stage magazine) |
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| Cycle time | Approx. 1.0 sec./piece (varies depending on process conditions) |
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| Dimensions | W1650×D1550×H1700 mm (excluding patlite) |
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| Equipment weight | Degree of 1500Kg |
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