
Overview
- This machine applies glue to sensor board and then mounts lens holders on them.
- Accurate mounting beyond that of conventional devices is now possible using image processing compensation and optical linear scale and high spec camera.
- Machine have achieved clean Class 100
Features
- Linear scale and 2 million pixel camera are adopted for the mounting process axis, and high-precision mounting (±10μm) is realized.
- Equipped with a twin dispenser and a high-speed mount head, a standard tact of 1.7 seconds per piece (*) is achieved.
*In case of optimum operating conditions: Necessary discussion on operating conditions - Cleanliness class 100 is achieved even during operation through thorough clean-up measures. Contamination defects are reduced by the static charge elimination and dust removal functions of workpieces.
- It is also very simple to create coating and mounting data for new models.
It supports three languages: Japanese, English, and Chinese.
Usage examples
This is the best device for VCM assembly that does not require active alignment.


Product Specifications
ITEM | DETAILS |
---|---|
Target sensor substrate | CCD/CMOS Sensor Board Size: L=50~250mm, W=40~100mm |
Object lens holder | □ 5 to 10 mm/tray supply (with/without lens barrel) |
Dispenser for adhesive application | ×2 units |
Onboard head | ×1 unit |
Adhesive application accuracy | ±35μm |
Equipment Precision | ±10μm |
Output | UPH ≧ 1600 |
Imaging feature | CCD camera: 4 sets Work alignment, board direction determination, bat mark detection, application presence/absence detection, holder direction determination, etc. |
Cleanliness inside the equipment | Class100 |
*Configuration and specifications of this machine are subject to partial modification without prior notice.