ACF/FPC Bonder
CM-F series

Camera module manufacturing

ACF/FPC Mounting

selling agency

PFA Corporation

Overview

  • Attach an anisotropic conductive film (ACF) to the camera module sensor board and thermo-crimp the FPC.
  • This machine is full automated equipment that achieves low profile, low temperature and clean connections.

Features

  • This highly reliable system employs image recognition and alignment technologies developed for COG bonders for flat panels.
  • The exclusive use jig tray for the model is not required (no work for aligning the workpiece to the jig tray) and when replacing the model, the replacement can be done only by replacing the special parts of individual pieces.
  • It can be connected to a loader for CM supply and an unloader for storage of finished products, and high productivity is achieved by full-automatic operation.

Usage examples

Fully automated low-profile, low-temperature and clean bonding by ACF mounting process.

Product Specifications

ITEMDETAILS
Target workpieceAF/FF camera module
W5×L5mm～W10～L10mm、H4~10 mm
FPC supplyTRAY SUPPLY, WITH TRAY CHANGER
CM supplyAutoloader and tray changer on CM board (optional)
Storage of finished productsAuto unloader, tray changer (with option)
Mounting accuracyACF application accuracy x=±200μ, y=±100μ
FPC mounting accuracy x,y=±20μ
Tact time3.5sec/pcs (for 8sec of this crimping condition)

*Configuration and specifications of this machine are subject to partial modification without prior notice.

Installation dimensions

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