About Yamaha Robotics
Co., Ltd.

Yamaha Robotics Co., Ltd. is a Yamaha Motor Co., Ltd. group company that handles semiconductor manufacturing equipment (back-end processing) and electronic component assembly equipment businesses.
In July 2019, Yamaha Motor Co., Ltd., Shinkawa Corporation, and APIC YAMADA Corporation merged their businesses to form Yamaha Motor Robotics Holdings Co., Ltd. (formerly known as Yamaha Motor Co., Ltd.), a holding company with Yamaha Motor Co., Ltd. as its parent company.
The company was delisted from the First Section of the Tokyo Stock Exchange in May 2020. The company became a wholly owned subsidiary of Yamaha Motor and changed its name to Yamaha Robotics Holdings, Inc. in January 2021.
Then, in July 2025, Yamaha Robotics Holdings Co., Ltd., Shinkawa Corporation, Apic Yamada Corporation, and PFA Corporation merged to form Yamaha Robotics Co., Ltd..

The birth of Japan's first total solution provider

Semiconductors and electronic components are the key infrastructure that supports the digital society, including 5G, big data, AI, IoT, and automated driving. They are used in a wide variety of products, such as PCs, smartphones, automobiles, home appliances, and factory equipment, and demand for them is growing.
As semiconductors and electronic components become smaller and thinner, they are required to have higher performance, and new needs are increasing, such as high integration and heterogeneous integration, which are difficult to produce with conventional production processes.

Yamaha Robotics provides a variety of manufacturing equipment for semiconductor back-end processes, and together with Yamaha Motor's solutions for surface mounting processes and industrial robots, will meet the diversifying needs of semiconductor and electronic component production as a "total solution provider from Japan.

Beautiful and smart "Solutions from Yamaha"

Yamaha Motor and Yamaha Robotics will combine Japan's manufacturing capabilities to create value that exceeds customer expectations as a borderless turnkey solution provider for semiconductor back-end processes and electronic component mounting processes, and provide optimal "1 STOP SMART SOLUTION".

Solutions created by our brand strengths

The three brands (SHINKAWA Series, APIC YAMADA Series, PFA Series) that support Yamaha Robotics combine their respective strengths in "connecting," "hardening," "cutting," "assembly," and "examination" with "transport" technology, deepening collaboration within the group to pursue high-quality, high-performance manufacturing with the aim of providing robotics solutions that are easy for customers to use and achieve stable production.

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SHINKAWA Series

SHINKAWA Series provides various bonding equipment solutions such as Die Bonding (DB), Wire Bonding (WB), Flip Chip Bonding (FC), etc., which connect semiconductor chips and substrates, based on the core technology of "Connecting".

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APIC YAMADA Series

APIC YAMADA series provides the molding process to "solidify" semiconductor packages, as well as our own molding technology, molding equipment, and molding dies. We also provide "cutting" solutions using ultra-precision dies, lead processing equipment, processing dies, lead frames, and parts.

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PFA Series

PFA series offers a wide range of assembly and manufacturing equipment for "assembling" semiconductors and electronic components. It is used in the manufacture of camera modules, crystal devices, FPDs (flat panel displays), and more. The PFA series also offers inspection and testing equipment for "seeing," meeting the needs for unmanned and labor-saving operations.

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