Molding System
WCM-330
【Compression Molding】
Fully Automated WLP Molding System
Molds selling agency
Overview
- FOWLP/FIWLP/eWLB compatible, high precision, high quality, fully automatic molding system
- High precision platen parallelism by adopting 4-axis linear motion motor
Equipped with a high-pressure 85-ton press that enables MUF molding technology - Both liquid and granular resin can be supplied.
- Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc.
SEMI S2 compliant, SEMI S8/CE optional - FOWLP: Fan-Out Wafer Level Package
FIWLP: Fan-In Wafer Level Package
EWLP: Embedded Wafer Level Package
Features
- Wide range of target sizes: 8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm orifla), Glass panel 320x320mm
- Equipped with upper and lower FAMEs to achieve high-quality full mold molding.
Independent control of 4-axis servo motors enables platen tilt adjustment by changing motor parameters. - Pursuit of WLP molding quality by 8-stage resin flow control
Stable high-speed transfer even for warped wafers. - Measures against electrostatic discharge (ESD) are taken at the wafer contact area.
Usage examples
High-quality of full molding by upper and lower FAME function
Product Specifications
| ITEM | DETAILS |
|---|
| Utilities | Electricity | 3-phase AC200V, 50Hz / 60Hz | |
| Air | 0.6MPa, 500L/min.(ANR) or more | ||
| Machine sizes *1 | Short (2 load ports) | (W)5,165 x (D)3,405 x (H)2,360mm | |
| Long (4 road ports) | (W)6,365 x (D)3,405 x (H)2,360mm | ||
| Machine weight | Short (2 load ports) | Approx. 13,500Kg | |
| Long (4 road ports) | Approx. 15,000Kg | ||
| Molding capacity | 1 wafer/shot/press | ||
| Cycle time | Approx. 14UPH *2 | ||
| Applicable mold sizes | Max. φ330mm | ||
| Compound type | Liquid & Granule | ||
| Press | 1mold / press | ||
| Clamping method | Direct servo motor driven bottom platen type | ||
| Clamping force | 49～833kN | ||
| Base unit type | Chase change type | ||
*1 There are two types of equipment sizes (short and long), and specifications
for supplying liquid resin and granulated resin.
The size of the system does not include the signal tower, monitor and etc.
*2 This thru-put is based on 400 sec cure time and 150 sec dispense time.
Specifications may be changed for improvements without any notice.
