Molding System
WCM-330 MS
【Compression Molding】
Manual WLP Molding System
Molds selling agency
Overview
"*High precision and high quality manual molding system compatible with FOWLP/FIWLP/EWLP High-precision platen parallelism achieved by 4-axis linear motion motor (AYC Patented) Equipped with a high-pressure 85-ton press that enables MUF molding technology Resin can be supplied in liquid, granule or sheet form. SEMI S2 compliant, SEMI S8/CE optional
*FOWLP: Fan-Out Wafer Level Package FIWLP: Fan-In Wafer Level Package EWLP: Embedded Wafer Level Package"
Features
- Wide range of target sizes
8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm oriflura), □330mm - Equipped with upper and lower FAMEs to achieve high-quality full mold molding.
- Independent control of 4-axis servo motors enables adjustment of platen inclination by changing motor parameters.
- Pursuit of WLP molding quality by 8-step resin flow control.
Usage examples
Wide range of target sizes
8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm oriflura), □330mm
Product Specifications
| ITEM | DETAILS |
|---|
| Utilities | Electricity | 3-phase AC200/220V, 50/60Hz | |
| Air | 0.5MPa, 100NL/min or more | ||
| Machine sizes | Standard | (W)2,270 x (D)1,435 x (H)2,070mm | |
| Option: Full molding | (W)2,270 x (D)2,000 x (H)2,070mm | ||
| Machine weight | Standard | Approx. 4,200Kg | |
| Option: Full molding | Approx. 4,360Kg | ||
| Capacity | 1 wafer/shot | ||
| Applicable wafer sizes | Max. Dia.12-inch / Max. Sq.330mm | ||
| Compound type | Liquid, Granule, Sheet | ||
| Press | 1mold/press | ||
| Clamping method | Servo motor press | ||
| Clamping force | 49 ~ 833kN | ||
| Film handling | Automatic feed | ||
| Base unit type | Chase change type | ||
* The size of the system dose not include the signal tower, etc.
※ Specifications may be changed for improvements without any notice.
