
Molding System
GTM-170T
【 Transfer Molding 】
Molding system for large scale ECU
Molds selling agency

Overview
- Transfer molding system for efficient mass production of power semiconductors and large electronic devices.
- Large-plate, high-output presses required for encapsulation of large devices.
- Dual in-line plunger layout supports large package products.
- Individual preheat stages ensure stable molding quality.
Features
- Large-capacity twin hopper for supplying mini tablets to large-sized packages
- Support for multiple mini tablets and high-cycle alignment to meet product tact time
Product tact time: 3.5 seconds (actual results for 3 press specification equipment) - The number of presses can be selected according to the production volume by the module connection system.
Product Specifications
ITEM | DETAILS |
---|
Utility | Power supply | 3-phase AC200/220V 50/60Hz | |
Compression air | 0.5MPa, 1500L/min (ANR) or more | ||
Applicable module PKG | Power Devices, ECU etc. | ||
Work placeable area | (W) Max. 110 mm x (L) Max. 200 mm x 4 areas/press | ||
Clamping force | 196~1,667kN (170tf) | ||
Transfer force | 4.9~98kN (10tf) | ||
Machine size (excluding the signal pole) | 1 press | (W) 3,950 x (D) 3,110 x (H) 2,300 mm | |
3 press | (W) 5,750 x (D) 3,110 x (H) 2,300 mm | ||
Machine weight (including the molds) | 1 press | Approx. 7,000kg | |
3 press | Approx. 15,000kg | ||
Applicable compound | Form | Mini tablet | |
Dia. | 13~20 mm | ||
Loading method | In-line Type | Pick & place from conveyer (provided by customer) | |
Stand-alone Type | Magazine loading | ||
Off-loading method | In-line Type | Pick & place to conveyer (provided by customer) | |
Stand-alone Type | Magazine off-loading |
*Specifications may be changed for improvements without any notice.