Molding System
GTM-170T

【 Transfer Molding 】
Molding system for large scale ECU

Molds

selling agency

APIC YAMADA CORPORATION

Overview

  • Transfer molding system for efficient mass production of power semiconductors and large electronic devices.
  • Large-plate, high-output presses required for encapsulation of large devices.
  • Dual in-line plunger layout supports large package products.
  • Individual preheat stages ensure stable molding quality.

Features

  • Large-capacity twin hopper for supplying mini tablets to large-sized packages
  • Support for multiple mini tablets and high-cycle alignment to meet product tact time
    Product tact time: 3.5 seconds (actual results for 3 press specification equipment)
  • The number of presses can be selected according to the production volume by the module connection system.

Product Specifications

ITEMDETAILS
UtilityPower supply3-phase AC200/220V 50/60Hz
Compression air0.5MPa, 1500L/min (ANR) or more
Applicable module PKGPower Devices, ECU etc.
Work placeable area(W) Max. 110 mm x (L) Max. 200 mm x 4 areas/press
Clamping force196~1,667kN (170tf)
Transfer force4.9~98kN (10tf)
Machine size
(excluding the signal pole)
1 press(W) 3,950 x (D) 3,110 x (H) 2,300 mm
3 press(W) 5,750 x (D) 3,110 x (H) 2,300 mm
Machine weight
(including the molds)
1 pressApprox. 7,000kg
3 pressApprox. 15,000kg
Applicable
compound
FormMini tablet
Dia.13~20 mm
Loading methodIn-line TypePick & place from conveyer (provided by customer)
Stand-alone TypeMagazine loading
Off-loading methodIn-line TypePick & place to conveyer (provided by customer)
Stand-alone TypeMagazine off-loading

*Specifications may be changed for improvements without any notice.

Related Products

Contact Us

For products and various inquiries, click here.

List of inquiries