Propose optimal solutions for semiconductor packaging processes
As the brand "APIC YAMADA series," our molding and lead forming equipment/molds play an essential role in semiconductor back-end processes.
We provide "solution proposals" that are optimal for our customers' packaging processes.
We respond quickly to our customers' needs by expanding our range of equipment and die solutions in response to the ever-evolving trends in semiconductor technology.
In addition, we will play a role in accelerating our customers' business by establishing a production system that can reliably supply the required timing and quantity in accordance with market trends.
Moving forward, we will continue to offer comprehensive solutions to our customers in the three areas of molding equipment, various automated equipment, and precision parts.
Technology Development & Various Development Partners for Solutions
In order to meet the evolving needs of the ever-advancing semiconductor industry, we continually pushes forward with research and development in a wide range of technological fields encompassing the packaging of semiconductors.
We accurately grasp trends in the global semiconductor industry trends, the efforts span a wide range of R&D themes, from the basic research into semiconductor packaging materials to the development of applied technologies and the creation of efficient, high-quality production environments.
In particular, our innovative achievement in molding technology, “FAME,” has been highly evaluated both within and outside the industry, and is being applied to our products.
Furthermore, we actively engage in open innovation through technical tie-ups within the YAMAHA Motor Group, joint R&D with clients and material companies, as well as joint research with universities and research institutes.
Through such multi-channeled R&D endeavors, we seek to create even more valuable and user-friendly products, building greater trust and satisfaction with our customers.
