SEMICON JAPAN / APCS 2026 展会通知

Yamaha Robotics Co., Ltd. will exhibit at the Advanced Packaging and Chiplet Summit (APCS) 2026 at SEMICON JAPAN 2026, which will be held at Tokyo Big Sight from Wednesday, December 9 to Friday, December 11, 2026.
At this APCS, we will be introducing the latest technologies and equipment for our SHINKAWA Series, APIC YAMADA Series, and PFA Series product brands that support advanced packaging in semiconductor post-processing.

We look forward to seeing you there.

　APCS 2026
　Dates: December 9(Wed) - 11(Fri),2026  10:00-17:00
　Venue: Tokyo Big Sight West Halls 1-4
　Access: Click here for accesse to the venue
　Organizer: SEMI Japan
　APCS 2026 Official Website
　Pre-registration on the exhibition website is required to visit
　the exhibition.
　Pre-registration is available    ▶ HERE

Exhibit:At this APCS, we will be introducing the latest technologies and equipment for our SHINKAWA Series, APIC YAMADA Series, and PFA Series product brands that support advanced packaging in semiconductor post-processing.
　　　 Exhibition details    ▶  HERE 
Booth: West Hall W2071  Yamaha Robotics Co., Ltd.