We are born in July 2019 with the goal of providing a total solution as the “Japan's First Turn-Key provider in the field of semiconductors back-end processing,” by integrating the technologies of Yamaha Motor.'s surface mounters (equipment which mounts electronic components and semiconductors on the surface of printed circuit boards) and Industrial Robots, Shinkawa's bonders, and Apic Yamada's molds (package encapsulation equipment).