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Semiconductor back-end process Manufacturing

• Die Bonders
• Bump Bonders
• Wire Bonder
• Flip Chip Bonders
• Other
• Molds
• Lead Processing
• Inspection

Crystal Device Manufacturing

• Blank Mounted
• Clean Curing Furnace
• Packing Masks
• Taping
• Glossy Leak
• Temperature Test
• Frequency Regulator
• Inspection

Camera module manufacturing

• Active Alignment
• ACF/FPC Mounting
• Holder Mounted
• Focus Adjustment
• Dispenser
• Lens Inserter