1．Dual bonding heads Multi-nozzle (8 nozzles per head)
Two 8-nozzle heads with compact design enable high precision force control and also support thin die processing.
2．Dual flip heads
Achieves high-speed pick-up by parallel processing with 2 flip heads.
3．Multi-die supply
Equipped with 2 supply units for each flip head unit. Feeds flip chips with no time loss!
1．High rigidity frame & beam
Meticulous structural analysis and test verification achieve both high-level accel-decel drive and high-precision.
2．Linear motor/driver designed in-house
Unique dedicated design gives high-speed along with superb positioning accuracy.
*Example of measurement results with shaft-spindle stopped
3．High resolution chip recognition camera
Missing bump check and precise position alignment using bump positions.
4．Maintaining high placement accuracy
Our in-house developed MACS (Multiple Accuracy Compensation System) has been upgraded and now achieves bonding accuracy ±5μm (3σ). Original heat analysis & heat compensating algorithm realizes consistent placement accuracy.
1．Newly developed dipping station
Tool-less/skill-less flux thickness setting saves product change-over time drastically.
2．Nozzle station (ANC : Auto Nozzle Change)
Auto nozzle changer handles chip size range from □2 to 30mm minimizing product change-over time.
*Example of measurement results with shaft-spindle stopped
3．Wafer feed unit
Wafer feeder with wafer expander & theta alignment mechanism as standard feature.
