Flip Chip Bonder
YSB55ｗ

Flip Chip Bonders

selling agency

SHINKAWA LTD.

Overview

  • High bonding accuracy and x3 productivity of conventional machines!
  • This brings a New Era in Semiconductor packaging for the expanding flip chip market.
  • High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000　UPH
  • High-Accuracy ±5μm (3σ)
  • High-Quality & Flexibility

Features

  • High-speed bonding through parallel processing enabled by a dual flip head and an 8-component synchronized bonding process
  • Outstanding positioning accuracy with a high-rigidity frame and control algorithms
  • Bump recognition camera for high-performance positioning alignment
  • Compact force control heads
  • Compatibility with a wide range of flip-chip sizes from 2mm square to 30mm square
  • Easy-to-configure Dipping station

Usage examples

Bonding process

High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH

1．Dual bonding heads Multi-nozzle (8 nozzles per head)

Two 8-nozzle heads with compact design enable high precision force control and also support thin die processing.

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2．Dual flip heads

Achieves high-speed pick-up by parallel processing with 2 flip heads.

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3．Multi-die supply

Equipped with 2 supply units for each flip head unit. Feeds flip chips with no time loss!

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High-Accuracy ±5μm (3σ)

1．High rigidity frame & beam

Meticulous structural analysis and test verification achieve both high-level accel-decel drive and high-precision.

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2．Linear motor/driver designed in-house

Unique dedicated design gives high-speed along with superb positioning accuracy.

*Example of measurement results with shaft-spindle stopped

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3．High resolution chip recognition camera

Missing bump check and precise position alignment using bump positions.

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4．Maintaining high placement accuracy

Our in-house developed MACS (Multiple Accuracy Compensation System) has been upgraded and now achieves bonding accuracy ±5μm (3σ). Original heat analysis & heat compensating algorithm realizes consistent placement accuracy.

High-Quality & Flexibility

1．Newly developed dipping station

Tool-less/skill-less flux thickness setting saves product change-over time drastically.

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2．Nozzle station (ANC : Auto Nozzle Change)

Auto nozzle changer handles chip size range from □2 to 30mm minimizing product change-over time.

*Example of measurement results with shaft-spindle stopped

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3．Wafer feed unit

Wafer feeder with wafer expander & theta alignment mechanism as standard feature.

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Promotional Video

Product Specifications

ITEMDETAILS
Product NamePackage Bonder
ModelYSB55w
Applicable substrateL240 x W200 to L50 x W50mm
Substrate thickness0.2 to 3.0mm
Transport directionLeft to Right (option : Right to Left)
Bonding accuracy±5µm (3σ) (When using Yamaha's standard components)
Throughput13,000UPH (Including processing time)
Applicable wafer size12 inch wafer
Applicable die size□2 to 30mm
Power supply3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply0.45MPa or more
External dimensionL2,090 x D1,866 x H1,550mm (YSB55w main unit & wafer feed unit)
WeightApprox. 3,600kg (YSB55w main unit & wafer feed unit)

*Specifications and appearance are subject to change without prior notice.

Installation dimensions

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