Molding System
WCM-330 MS

【Compression Molding】
Manual WLP Molding System

"*High precision and high quality manual molding system compatible with FOWLP/FIWLP/EWLP High-precision platen parallelism achieved by 4-axis linear motion motor (AYC Patented) Equipped with a high-pressure 85-ton press that enables MUF molding technology Resin can be supplied in liquid, granule or sheet form. SEMI S2 compliant, SEMI S8/CE optional

*FOWLP: Fan-Out Wafer Level Package FIWLP: Fan-In Wafer Level Package EWLP: Embedded Wafer Level Package"

• Wide range of target sizes
  　8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm oriflura), □330mm
• Equipped with upper and lower FAMEs to achieve high-quality full mold molding.
• Independent control of 4-axis servo motors enables adjustment of platen inclination by changing motor parameters.
• Pursuit of WLP molding quality by 8-step resin flow control.

Wide range of target sizes
8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm oriflura), □330mm