Molding System
WCM-330 MS

【Compression Molding】
Manual WLP Molding System

Molds

selling agency

APIC YAMADA CORPORATION

Overview

  • High precision and high quality manual molding system compatible with FOWLP/FIWLP/EWLP.
  • Equipped with a high-pressure 85-ton press that enables MUF molding technology.
  • Resin can be supplied in liquid, granule or sheet form.
  • SEMI S2 (compliant), SEMI S8/CE (optional)

    *FOWLP: Fan-Out Wafer Level Package / FIWLP: Fan-In Wafer Level Package  / EWLP: Embedded Wafer Level Package

Features

  • Wide range of target sizes
    8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm oriflura), □330mm
  • Equipped with upper and lower FAMEs to achieve high-quality full mold molding.
  • Pursuit of WLP molding quality by 8-step resin flow control.

Usage examples

Wide range of target sizes
8-inch wafers, 12-inch wafers, SUS carrier φ350mm (340mm oriflura), □330mm

Product Specifications

ITEMDETAILS
UtilitiesElectricity3-phase AC200/220V, 50/60Hz
Air0.5MPa, 100NL/min or more
Machine sizesStandard(W)2,270 x (D)1,435 x (H)2,070mm
Option: Full molding(W)2,270 x (D)2,000 x (H)2,070mm
Machine weightStandardApprox. 4,200Kg
Option: Full moldingApprox. 4,360Kg
Capacity1 wafer/shot
Applicable wafer sizesMax. Dia.12-inch / Max. Sq.330mm
Compound typeLiquid, Granule, Sheet
Press1mold/press
Clamping methodServo motor press
Clamping force49 ~ 833kN
Film handlingAutomatic feed
Base unit typeChase change type

* The size of the system dose not include the signal tower, etc.
※ Specifications may be changed for improvements without any notice.

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