Die Bonder
STC-800

High speed and High Precision Die Bonder for Small Chips with Eutectic, WBC/DAF* and Epoxy Bonding Process Capabilities One type of die bonder. A high-speed die bonder for small signal transistors, diodes, and other small sized dies. A die is picked up from a wafer and directly bonded onto a lead frame in a thermal eutectic manner. The machine automatically detects reject identification marks and large chipping on dies in a wafer sheet, and picks up only the good dies. Lead frames are fed from the lead frame stack loader and unloaded to the unloader magazine after bonding.

1. Bonding accuracy ±20μm (3σ) (option: ±15um (3σ))
2. 10% increase in UPH compared with conventional models
3. High precision lead frame indexing　utilizing linear drive
4. Capable of handling 86mm width lead frames for bonding up to 76mm Y axis bonding area (for thermo-eutectic bonding)
5. Capable of handling various device conditions (with parameter settings for wafer tape expansion amount, and zoom function for die recognition camera)
6. Capable of handling epoxy bonding (with dual bonding heads) by installing epoxy unit
7. Capable of handling 100mm width and 300mm length lead frames with universal indexer (for paste dispensing method)
8. Additional higher accuracy and various inspection functions available with die backside camera (option)
9. Conversion kit available for eutectic, WBC/DAF*, and epoxy processes

*WBC/DAF : Wafer Backside Coating / Die Attach Film