Leadframes High-precision, micro-pressed parts

Since its establishment, stamping die manufacturing has been one of the core technologies of the APIC YAMADA Group. 1971 was the first year that the company began mass production of lead frames for semiconductors. In 1971, we began mass production of leadframes for semiconductors, and as IC devices became more pin-centric, the precision of our dies increased, and we have now succeeded in manufacturing QFP216L dies with a minimum lead pitch of 148um and a tip lead width of 72um. We have also received high praise from our customers for our molds for cutting and bending leads after resin encapsulation using this basic technology.

Design and manufacture of ultra-precision press dies
　1-1. Various die design know-how acquired through semiconductor press parts
　1-2. high control technology of burr, dullness and torsion
　1-3. mass production of ultra-thin materials Achievements: Min. 25μm
　　　　(including design and production of ultra-small clearance dies)　　
Mass production technology (press work + quality control)
　2-1. Optimization of press conditions and maintenance activities led by skilled operators
　2-2. thorough defect reduction activities and results
　2-3. Quality control system in accordance with IATF16949 (2016)
3. support for various prototypes
　3-1 Providing high quality equivalent to mass production from the prototype stage (new product vertical start-up)
　3-2. ability and track record to propose optimal manufacturing methods for high-mix, low-volume production