Capable of handling face down process (face up process as an option)
Capable of handling several kinds of processes such as TCB (NCP/NCF/TC-CUF), C2 and C4, and FO-WLP
Features
High-accuracy bonding achieved by adopting the unique Non-vibration System (NVS) technology
Capable of handling high force up to 350N with Force Free Gantry (FFG)
High throughput achieved by short heating and cooling time with high-speed pulse heater
Process monitoring and management function securing stable quality and process portability
Flexibility to handle various plunge-up systems, enabling thin die handling
Automatic product-type changeover function with capability to bond up to 4 different product-type chips, enabling 2.5D and 3D stack packaging
High-productivity and space-saving footprint
Flexible support for the following options: 1.Supporting face-up process 2.Mounting TCB for large chips (□35mm) 3.Transferring and applying FLUX material to chips
