
Overview
- This machine is high-speed and clean processing of various resin coatings on camera module sensor boards.
- Manufacture custom-made dispensers that apply to the side and back sides of the module.
Features
- Equipped with a four-head (two-head, two-station) dispence robot for high-speed processing.
- It is also ideal for applications where two types of resins are applied.
- The dispenser is equipped with an air pulse type as standard. It is also possible to respond to jet dispence.
- Achieved cleanness class 100 even during operation through thorough clean-up measures.
- Creating coating data for new models is also very simple.
- Compatible with three languages: Japanese, English, and Chinese.
Usage examples
Examples of coating resins: Adhesive coating, dust trap coating, antireflective coating
Product Specifications
ITEM | DETAILS |
---|---|
Target sensor substrate | CMOS image sensor board Carrier size: L50 to 250mm, W=40 to 100 |
Target side board | □ 5 to 13.5 mm/carrier supply, or collective substrate |
Dispenser for adhesive application | ×4 units |
Imaging feature | CCD camera: 4 sets Work alignment, board direction determination, bat mark detection, application presence/absence detection, etc. |
Cleanliness inside the equipment | Class100 |
*Configuration and specifications of this machine are subject to partial modification without prior notice.