In addition to transfer molding, compression molding is another type of plastic molding. In addition to molding the wafer itself, compression molding can be used to mold large panels, strip substrates, metal carriers, glass substrates, and other advanced logic products. In addition to molding the wafer itself, compression molding can also be used to mold large panels, strip substrates, metal carriers, glass substrates, and other advanced logic products. In compression molding, FAME and decompression molding are essential.
"Another advantage of compression molding is that it does not require a transfer mechanism. Another advantage of compression molding is that it does not require a transfer mechanism, so there are no problems such as resin burrs or dust. Furthermore, compression molding allows for 100% resin utilization (zero waste). This is in line with the demand to reduce the environmental burden.
