Trim & Form System
COMBO-300SW
For wider leadframe and higher productivity
Lead Processing selling agency
Overview
Higher matrix and larger frame size for more productivity isbeing continued to the next stage, where the ordinary T/Fsystem can not comply.
COMBO-300SW is new-released to comply to this kind of needs. This system can handle 300mmL x 100mmW, 8-linematrix frame.
*COMBO-300DC, which has tool compatibility with old A-COMBO is also available.
COMBO-300SW is new-released to comply to this kind of needs. This system can handle 300mmL x 100mmW, 8-linematrix frame.
*COMBO-300DC, which has tool compatibility with old A-COMBO is also available.
Features
- Continuous molding cycle of 140 spm is achievable by synchronized press operation and unique material handling mechanism.
- Each function is modularized to accommodate the multifunctional front and rear processes of semiconductor manufacturing.
The system can be easily reconfigured and added after delivery. - In the trim & forming area of the machine, a full-open function is provided for the press mechanism used to drive the machine, making it easy to perform mold maintenance.
Option support
- Image processing/supply frame confirmation (supply direction, different frame discrimination)
- Detection of two frames stacked each other (at Feeding section with checking for feeding errors)
- Ejection of different frames (at supply side, removal of NG products for visual inspection)
- Area sensor at press unit (to ensure safety inside the mold access door)
- Shot counter (shot management for each die)
- Support for additional function modules (press unit addition, vision module addition, etc.)
- Visual inspection / blade breakage detection
- Undercut inspection (detection of foreign object damage in die)
- Visual inspection/forming lead inspection *Addition of functional module
Product Specifications
| D/D | T/F | |
|---|---|---|
| Index speed* | 140SPM | 70SPM |
| System size | (W)1,938 × (D)1,170 × (H)1,850mm | (W)2,720 × (D)1,429 × (H)1,850mm |
| System weight | Approx. 2,000kg | Approx. 2,500kg |
| Conversion Time | Approx. 15min. | Approx. 30min. |
| Main system configuration | 2 stack magazine loader | 2 stack magazine loader |
| 1 head power module | 1 head power module | |
| 2 stack magazine off-loader | JEDEC tray off-loader | |
| Leadframes | Width: 40~100mm Length: 180~300mm Thickness: 0.1~0.25mm | |
| Unit-Column Pitch: 8~55mm Side Rail Width: Min. 2.5mm | ||
| Package Size: (7 X 7)~(32 X 32)mm Number of Rows: Max. 8 Leadframe Based Package Families excluding J-Bend, DIP and QFN. | ||
| Magazines | C-Type Open stack magazine | |
| Width: 44~104 mm Length: 184~304 mm Height: 210~455mm | ||
| Trays | － | JEDEC Std. Plastic Hard Trays Pocket Pitch (X&Y): Min. 8mm |
| Noise level | Max. 80dB | |
| Options | Image processing / Supply frame confirmation (supply direction, different frame identification) | |
| Double-Strip Check (On-loader) | ||
| Wrong Strip Reject | ||
| Press Safety Beam Sensor | ||
| Shot Counter | ||
| Support for additional function modules (additional presses, additional vision modules, etc.) | ||
| Image inspection/blade breakage detection | - | |
| Bottom dead inspection output (detection of foreign object damage in die set) | - | |
| - | Image inspection/Forming lead inspection *Additional function module | |
* The index speed is subject to vary according to the product.
Specifications and appearance are subject to change without notice for improvement or enhancement.
