News Release
- Notice of Discontinuation of Flip-Chip Bonder YSB55w
- Announcement of Personnel Change in the Board of Directors
- Shinkawa to Release Next-generation High-Speed Wire Bonder: UTC-RZ1
- Multi-process auto-molding equipment Launched the "MS-R Series"
- SEMICON JAPAN / APCS 2024 Exhibition
- Shinkawa ／Notice of Discontinuation of Die Bonder SPA-1000
- Relocation of Overseas Group Company
- Our support for “ABU ROBOCON 2024”
- Establishment of SATAS
- Notice of Exhibit at SEMICON CHINA 2024