Dispenser ’PFD-10’allows for thick and flat dispense
~It is possible to perform uniform and thick film dispense
with a flat nozzle made by PFA and dispense volume control with a motor~
PFA CORPORATION has developed Flat Dispenser ‘PFD-10’which dispenses sintering paste to expand into a sintering market that has been gathering attention recently. In addition to sintering paste, it can be used for dispensing TIM (Thermal Interface Material) for heat dissipation or protection of high performance semiconductors and power semiconductors.
You can adjust dispense width according to the dedicated nozzle. The structure inside the nozzle allows for uniform and thick film dispense raging from about 200 to 500μm. It performs height measurement before the dispense with a displacement gauge so that it can dispense on the substrate with uneven areas. It also dispenses paste locally, so it can reduce material loss of 20 to 30%, which contributes to material cost down.

Flat Dispenser ’PFD-10’
Market background and equipment outline
Power modules for automotive applications have a structure in which we attach a cooling device to a package in which semiconductor chips are mounted on the board. As the bonding material, we often use sintering paste which has excellent heat resistance and heat dissipation. Especially, in the process of bonding a cooling device and the substrate called ‘Package attach,’ thin film dispense is lack of bonding reliability due to the warpage of the cooling device. To meet the demand for thick film dispensers, we have developed the ‘PFD-10’ which can flatly dispense sintering paste on the cooling devices.
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