Yamaha Robotics Holdings Co., Ltd. will exhibit at the Advanced Packaging and Chiplet Summit (APCS) 2024 at SEMICON JAPAN 2024, which will be held at Tokyo Big Sight from Wednesday, December 11 to Friday, December 13, 2024.
At this year's APCS, we will introduce SHINKAWA's bonders, APIC YAMADA's Mold systems and PFA's latest module assembly technology for advanced packaging in the semiconductor back-end processing.
As part of the JISSO exhibition, Yamaha Motor Co., Ltd will be introducing surface mounters and industrial robotics automation technology.
We look forward to seeing you there.
Dates: December 11 (Wed) ~ 13 (Fri), 2024 10:00-17:00
Venue: Tokyo Big Sight East Halls 1-3
Access: Click here for access to the venue
Organizer:SEMI Japan
Pre-registration on the exhibition website is required to visit
the exhibition.
Pre-registration is available ▶ HERE
Exhibit : Yamaha Robotics Holdings Group's Shinkawa, APIC Yamada, PFA Corporation, and Yamaha Motor will exhibit its related products and technologies.
Booth: East Hall 1-3, Booth No.: 2039 Yamaha Robotics Holdings, Co., Ltd.
Yamaha Robotics Holdings Co., Ltd.
Sales Department