Yamaha Robotics Co., Ltd. will exhibit at the Advanced Packaging and Chiplet Summit (APCS) 2025 at SEMICON JAPAN 2025, which will be held at Tokyo Big Sight from Wednesday, December 17 to Friday, December 19, 2025.
At this APCS, we will be introducing the latest technologies and equipment for our SHINKAWA Series, APIC YAMADA Series, and PFA Series product brands that support advanced packaging in semiconductor post-processing.
We look forward to seeing you there.
Dates: December 17(Wed) ~ 19(Fri),2025 10:00~17:00
Venue: Tokyo Big Sight East Holls 4~6
Access: Click here for accesse to the venue
Organizer: SEMI Japan
APCS 2025 Official Website
Pre-registration on the exhibition website is required to visit
the exhibition.
Pre-registration is available ▶ HERE
Exhibit:At this APCS, we will be introducing the latest technologies and equipment for our SHINKAWA Series, APIC YAMADA Series, and PFA Series product brands that support advanced packaging in semiconductor post-processing.
Exhibition details ▶ HERE
Booth:East Hall E4836 Yamaha Robotics Co., Ltd.
Yamaha Robotics Co., Ltd.
Sales Strategy Division